10/30211454 DC
10/30211454 DC
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10/30211454 DC

BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures

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10/30211454 DC

BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £20 (50% discount for members - click here for more information)

10/30211454 DC

BS EN 62047-13. Semiconductor devices. Micro-electromechanical devices. Part 13. Bend- and shear- test methods of measuring adhesive strength for MEMS structures

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £20 (50% discount for members - click here for more information)
Product details for 10/30211454 DC
Category: ELECTRONICS

Publication date:

Product detail: 13 pages

ISBN reference: 0000000000978

Cross references to standards relating to 10/30211454 DC:

Keywords: Semiconductor devices, Electronic equipment and components, Electromechanical devices, Vocabulary, Terminology, Semiconductor technology, Integrated circuits

Variations and abbreviations: 10/30211454DC,10/30211454 DC

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