15/30321848 DC
15/30321848 DC
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15/30321848 DC

BS EN 62047-27. Semiconductor devices. Micro-electromechanical devices. Part 27. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

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15/30321848 DC

BS EN 62047-27. Semiconductor devices. Micro-electromechanical devices. Part 27. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £20 (50% discount for members - click here for more information)

15/30321848 DC

BS EN 62047-27. Semiconductor devices. Micro-electromechanical devices. Part 27. Bond strength test for glass frit bonded structures using micro-chevron-tests (MCT)

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £20 (50% discount for members - click here for more information)
Product details for 15/30321848 DC
Category: ELECTRONICS

Publication date:

Product detail: 16 pages

ISBN reference: 978 0 580 89908 9

Cross references to standards relating to 15/30321848 DC:

Keywords: Semiconductor devices, Electronic equipment and components, Electromechanical devices, Semiconductor technology, Integrated circuits, Thin-film devices, Fatigue testing, Bend testing, Resonance, Vibration, Test specimens, Test equipment

Variations and abbreviations: 15/30321848DC,15/30321848 DC

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