BS EN 60749-20-1:2009
BS EN 60749-20-1:2009
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BS EN 60749-20-1:2009

Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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BS EN 60749-20-1:2009

Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £206 (50% discount for members - click here for more information)

BS EN 60749-20-1:2009

Semiconductor devices. Mechanical and climatic test methods. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £206 (50% discount for members - click here for more information)
Product details for BS EN 60749-20-1:2009
Category: ELECTRONICS

Publication date:

Product detail: 36 pages

ISBN reference: 978 0 580 54601 3

Cross references to standards relating to BS EN 60749-20-1:2009:

Keywords: Packaging, Materials handling, Surface mounting devices, Thermal testing, Environment (working), Soldering, Labelling (process), Environmental testing, Climate, Integrated circuits, Damp-heat tests, Electronic equipment and components, Semiconductor devices, Transportation, Mechanical testing

Variations and abbreviations: BS60749-20-1:2009,BS60749,BS 60749
Standards in the BS 60749 series:  BS EN 60749-5:2017   BS EN 60749-29:2003   BS EN 60749-30:2005   BS EN 60749-9:2017   BS EN 60749-3:2017  


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