BS EN 62047-9:2011
BS EN 62047-9:2011
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BS EN 62047-9:2011

Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS

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BS EN 62047-9:2011

Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £176 (50% discount for members - click here for more information)

BS EN 62047-9:2011

Semiconductor devices. Micro-electromechanical devices. Wafer to wafer bonding strength measurement for MEMS

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £176 (50% discount for members - click here for more information)
Product details for BS EN 62047-9:2011
Category: ELECTRONICS

Publication date:

Product detail: 32 pages

ISBN reference: 978 0 580 78793 5

Cross references to standards relating to BS EN 62047-9:2011:

Keywords: Adhesion tests, Semiconductor technology, Integrated circuits, Adhesive strength, Visual inspection (testing), Shear testing, Bend testing, Electromechanical devices, Electronic equipment and components, Electrostatics, Substrates (insulating), Tensile testing, Bonding, Semiconductor devices

Variations and abbreviations: BS62047-9:2011,BS62047,BS 62047
Standards in the BS 62047 series:  BS IEC 62047-29:2017   BS IEC 62047-30:2017   BS EN 62047-25:2016   BS EN 62047-26:2016   BS EN 62047-1:2016  


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