BS EN 62137-4:2014
BS EN 62137-4:2014
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BS EN 62137-4:2014

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

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Printed publication for Next Day or Standard Delivery
Price:  £232 (50% discount for members - click here for more information)

BS EN 62137-4:2014

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £232 (50% discount for members - click here for more information)

BS EN 62137-4:2014

Electronics assembly technology. Endurance test methods for solder joint of area array type package surface mount devices

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £232 (50% discount for members - click here for more information)
Product details for BS EN 62137-4:2014
Category: ELECTRONICS

Publication date:

Product detail: 48 pages

ISBN reference: 978 0 580 89842 6

Cross references to standards relating to BS EN 62137-4:2014:

Keywords: Electronic equipment and components, Surface mounting devices, Integrated circuits, Printed-circuit boards, Soldered joints, Soldering, Solders, Environmental testing, Endurance testing, Mechanical testing, Thermal testing, Life (durability)

Variations and abbreviations: BS62137-4:2014,BS62137,BS 62137
Standards in the BS 62137 series:  BS EN 62137-4:2014   BS EN 62137:2004   BS EN 62137-3:2012   BS EN 62137-1-5:2009   BS EN 62137-1-2:2007  


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