18/30375624 DC
18/30375624 DC
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18/30375624 DC

BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

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18/30375624 DC

BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £20 (50% discount for members - click here for more information)

18/30375624 DC

BS EN 60749-20-1. Semiconductor devices. Mechanical and climatic test methods. Part 20-1. Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £20 (50% discount for members - click here for more information)
Product details for 18/30375624 DC
Category: ELECTRONICS

Publication date: 2018-07-13

Product detail: 39 pages

ISBN reference: 978 0 580 97125 9

Cross references to standards relating to 18/30375624 DC:

Keywords: Semiconductor devices, Transportation, Thermal testing, Labelling (process), Soldering, Integrated circuits, Electronic equipment and components, Surface mounting devices, Mechanical testing, Packaging, Environmental testing, Environment (working), Damp-heat tests, Materials handling, Climate

Variations and abbreviations: 18/30375624DC,18/30375624 DC

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