ASTM F1894 - 98(2011)
ASTM F1894 - 98(2011)
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ASTM F1894 - 98(2011)

Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness

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ASTM F1894 - 98(2011)

Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £40 (50% discount for members - click here for more information)

ASTM F1894 - 98(2011)

Test Method for Quantifying Tungsten Silicide Semiconductor Process Films for Composition and Thickness

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £40 (50% discount for members - click here for more information)
Product details for ASTM F1894 - 98(2011)
Category: ELECTRICAL ENGINEERING

Publication date: 2011-01-06

Product detail: 7 pages

ISBN reference: 978 0 580 68140 0

Cross references to standards relating to ASTM F1894 - 98(2011):

Keywords: Analysis of tungsten silicide, Backscattering analysis, Composition, Metallization films, Quantitative analysis, RBS, WSix, Backscattering analysis, Composition analysis-semiconductor applications, Density-electronic applications, Metal electronic components/devices, Quantitative analysis/measurement, Rutherford backscattering spectrometry, Tungsten silicide (WSix)

Variations and abbreviations: ASTMF1894-98(2011),ASTMF1894,ASTM F1894
Standards in the ASTM F1894 series:  ASTM F1894 - 98(2003)   ASTM F1894 - 98(2011)  


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