BS EN 60749-20:2009
BS EN 60749-20:2009
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BS EN 60749-20:2009

Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

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BS EN 60749-20:2009

Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £182 (50% discount for members - click here for more information)

BS EN 60749-20:2009

Semiconductor devices. Mechanical and climatic test methods. Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £182 (50% discount for members - click here for more information)
Product details for BS EN 60749-20:2009
Category: ELECTRONICS

Publication date: 2010-01-31

Product detail: 32 pages

ISBN reference: 978 0 580 59478 6

Cross references to standards relating to BS EN 60749-20:2009:

Keywords: Mechanical testing, Solderability testing, Soldering, Integrated circuits, Semiconductor devices, Electronic equipment and components, Environmental testing, Damp-heat tests, Surface mounting devices, Encapsulated, Thermal testing, Climate, Plastics

Variations and abbreviations: BS60749-20:2009,BS60749,BS 60749
Standards in the BS 60749 series:  BS EN IEC 60749-18:2019   BS EN IEC 60749-17:2019   BS EN 60749-29:2003   BS EN 60749-30:2005   BS EN 60749-7:2002  


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