BS EN 61191-3:2017
BS EN 61191-3:2017
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BS EN 61191-3:2017

Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies

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Printed publication for Next Day or Standard Delivery
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BS EN 61191-3:2017

Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £182 (50% discount for members - click here for more information)

BS EN 61191-3:2017

Printed board assemblies. Sectional specification. Requirements for through-hole mount soldered assemblies

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £182 (50% discount for members - click here for more information)
Product details for BS EN 61191-3:2017
Category: ELECTRONICS

Publication date: 2017-09-25

Product detail: 26 pages

ISBN reference: 978 0 580 91722 6

Cross references to standards relating to BS EN 61191-3:2017:

Keywords: Boards, Wires, Holes, Soldering, Printed circuits, Joints, Electrical components, Printed-circuit boards, Defects, Microassembling, Electrical equipment, Surface properties, Electronic equipment and components, Integrated circuits, Semiconductor devices

Variations and abbreviations: BS61191-3:2017,BS61191,BS 61191
Standards in the BS 61191 series:  BS EN IEC 61191-1:2018   BS EN 61191-4:2017   BS EN 61191-3:2017   BS EN 61191-2:2017   BS EN 61191-2:2013  


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