BS EN 62047-13:2012
BS EN 62047-13:2012
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BS EN 62047-13:2012

Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

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BS EN 62047-13:2012

Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £130 (50% discount for members - click here for more information)

BS EN 62047-13:2012

Semiconductor devices. Micro-electromechanical devices. Bend-and shear-type test methods of measuring adhesive strength for MEMS structures

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £130 (50% discount for members - click here for more information)
Product details for BS EN 62047-13:2012
Category: ELECTRONICS

Publication date: 2012-05-31

Product detail: 18 pages

ISBN reference: 978 0 580 69450 9

Cross references to standards relating to BS EN 62047-13:2012:

Keywords: Semiconductor devices, Semiconductor technology, Electromechanical devices, Test equipment, Resonance, Integrated circuits, Bend testing, Test specimens, Fatigue testing, Electronic equipment and components, Thin-film devices, Vibration

Variations and abbreviations: BS62047-13:2012,BS62047,BS 62047
Standards in the BS 62047 series:  BS IEC 62047-36:2019   BS IEC 62047-34:2019   BS IEC 62047-33:2019   BS IEC 62047-31:2019   BS IEC 62047-32:2019  


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