BS EN 62047-25:2016
BS EN 62047-25:2016
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BS EN 62047-25:2016

Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area

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BS EN 62047-25:2016

Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £182 (50% discount for members - click here for more information)

BS EN 62047-25:2016

Semiconductor devices. Micro-electromechanical devices. Silicon based MEMS fabrication technology. Measurement method of pull-press and shearing strength of micro bonding area

Purchase Options: Immediate PDF Download

Printed publication for Next Day or Standard Delivery
Price:  £182 (50% discount for members - click here for more information)
Product details for BS EN 62047-25:2016
Category: ELECTRONICS

Publication date: 2016-11-30

Product detail: 28 pages

ISBN reference: 978 0 580 85615 0

Cross references to standards relating to BS EN 62047-25:2016:

Keywords: Semiconductor technology, Integrated circuits, Electronic equipment and components, Resonance, Electromechanical devices, Thin-film devices, Bend testing, Vibration, Test specimens, Fatigue testing, Test equipment, Semiconductor devices

Variations and abbreviations: BS62047-25:2016,BS62047,BS 62047
Standards in the BS 62047 series:  BS IEC 62047-36:2019   BS IEC 62047-34:2019   BS IEC 62047-33:2019   BS IEC 62047-31:2019   BS IEC 62047-32:2019  


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